Slurry recycling system

Slurry Recycling System Overview

Using the Slurry Recycling System to reduce the production cost of semi-conductor wafers and glass substrate

By removing unwanted powder and fragments generated through the lapping and polishing of semi-conductor wafers, glass substrates and crystal substrates etc. from used slurry, it is possible to reuse slurry time and again.
However, due to the difficulty of removing unwanted powder and fragments from the slurry, and in order to maintain production accuracy, currently many companies discarded slurry after only a single use.This not only increases considerably the cost of production but also creates an industrial waste problem.The hydrocyclone slurry recycling system not only removes unwanted powder and material fragments, but can also recover 50-80% of abrasive material suitable for re-use. Thus reducing both the cost of production and of waste disposal.
Recovery rate varies according to the amount of times a batch of abrasive is used.

Before introducing the slurry recycling system


After introducing the slurry recycling system


System flow

Thanks to the utilization of hydrocyclone technology, Murata Kogyo`s slurry recycling system requires little floor space and is inexpensive.
Slurry recycling system flow

Cost Benefits

By installing the Murata Kogyo Slurry recycling system the following cost benefits are obtainable.

Cost Benefit Analysis

(Based on the following assumptions - Abrasive usage 10t/year, Abrasive cost \500/kg, Industrial waste disposal charge\40000/t, 65% recovery rate, Slurry density of 20wt%)
  Cost of Abrasives Waste disposal fee Sum
Before Introduction \5000000 \2000000 \7000000
After Introduction \1750000 \1500000 \3250000
SAVING \-3250000 \-500000 \-3750000

Costing Breakdown (as a percentage)

image chart

Recycling System Process Precision

The Murata Kogyo Slurry Recycling System is able to remove with high precision, reusable abrasive particles from slurry used in the lapping process.

AZ#1500 recycling test results - particle size distribution

Lapping Waste Slurry
Used slurry
Abandoned Slurry
Abandonment slurry
Unused Abrasive
Recycling slurry
Recovered Slurry
Unused abrasive
  Particle Size Distribution (m) SEISHIN LMS-30
  D10 D50 D100
Lapping Waste Slurry 1.317 3.850 7.833
Abandoned Slurry 0.870 1.626 3.250
Recovered Slurry 4.122 6.206 9.288
Unused Abrasive 3.840 6.527 10.883

Example of Usage

Company Work Purpose
A Crystal Wafer Lapping and Polishing Waste Liquid Recovery
B LCD Glass Substrate Polishing Waste Liquid Recovery
C HD Glass Substrate Lapping Waste Liquid Recovery
D Optical Lense Polishing Waste Liquid Recovery
E Silicon Wafer Lapping Waste Liquid Recovery
F Gallium Wafer Lapping Waste Liquid Recovery
*Aside from those mentioned above many customers in the crystal oscillation and glass industries are utilizing the Murata Kogyo Slurry Recycling System.

Example Product

Lapping slurry recycling system for crystal semiconductor manufacturer

An example of a lapping slurry recycling system designed and manufactured for a customer producing crystal oscillation units.

Recovery of Abrasive Material GC#1000
Treatment Quantity 2.5k/min
External Dimensions W2100~D1200~H2100
Weight 800kg
The above is an actual example of one possible method of utilization. In practice details such as tank capacity, processing quantity etc. will be determined prior to manufacture and after consultation with our team of designers and engineers.

Development and Production Process

Current waste liquid situation and process quantity aspirations discussed

2.Recovery Test
A test is conducted on the clientfs waste slurry and a batch of recycled slurry is produced for use in the subsequent polishing test.

3.Lapping Test
The aforementioned recycled slurry is passed through the clients lapping equipment to verify the scratch and polishing rates.

4.System Proposal and (Cost) Estimation
A detailed meeting is conducted at which time system proposal and estimation

5. Determine Method of Introduction


7. Delivery and Installation